Imec and ASML to Strengthen Collaboration on High-NA EUV Lithography Pilot Line

Imec and ASML are expanding their partnership to further develop a High-NA EUV lithography pilot line at imec. The primary objective of the pilot line is to enable industries utilizing semiconductor technologies to explore the potential of advanced semiconductor technology and gain access to a prototyping platform that supports their innovative projects. Through collaboration with ASML, imec, and other partners, novel semiconductor applications can be explored, sustainable manufacturing solutions for chip makers and end users can be developed, and advanced holistic patterning flows can be created in conjunction with the equipment and material ecosystem.

As part of this collaboration, ASML will install and service their complete suite of advanced lithography and metrology equipment at the imec pilot line in Leuven, Belgium. This includes the latest models of EUV lithography systems such as the 0.55 NA EUV (TWINSCAN EXE:5200) and the 0.33 NA EUV (TWINSCAN NXE:3800), as well as DUV immersion (TWINSCAN NXT:2100i), Yieldstar optical metrology, and HMI multi-beam systems. This engagement represents a significant investment in advancing the capabilities of the pilot line.

The development of High-NA technology is of utmost importance for the creation of high-performance, energy-efficient chips, including next-generation AI systems. It also opens doors for innovative deep-tech solutions that can address major societal challenges in healthcare, nutrition, mobility/automotive, climate change, and sustainable energy.

To ensure broad industry access to High-NA EUV lithography beyond 2025 and maintain Europe's advanced node process R&D capabilities, substantial investments are required. This agreement marks the beginning of an intensive collaboration between ASML and imec, focusing on High-NA EUV technology. The initial phase of process research is already underway at the joint imec-ASML High-NA lab, utilizing the first High-NA EUV scanner (TWINSCAN EXE:5000). Imec and ASML are working alongside leading-edge chipmakers, materials suppliers, and equipment ecosystem partners to accelerate the adoption of this technology in mass manufacturing. The next phase will involve scaling up these activities at the imec pilot line in Leuven using the next-generation High-NA EUV scanner (TWINSCAN EXE:5200).

The intensified collaboration between ASML and imec in lithography and metrology technology aligns with the goals and plans of the European Commission and its member states, as represented by initiatives like the Chips Act and IPCEI. These efforts aim to strengthen innovation and address societal challenges. As part of this collaboration, an IPCEI proposal capturing the partnership between imec and ASML is currently under review by the Dutch government.